Quad 4000C SMT Placement System:

A Pick-and-Place Machine (PPM) offers economic advantages for mid-volume board assembly.  The PPM performs high-precision placement of surface-mount technologies (SMT) for improved production and efficiency.  This modular assembler offers a comprehensive range of solutions for diverse SMT applications.

How the QuadAlign System works:  The optical alignment process begins when the host controller sends a description of the component to the QuadAlign system. After component pickup, the monitoring and alignment process takes place while the placement head travels to the designed PCB coordinate for placement. Using the assembler’s built-in adaptive process control, the pickup location, the scan height, and other key process parameters are monitored and altered to optimize the placement accuracy.  

Ultrasonic Cleaning This commercial grade ultrasonic cleaner has 10 sets of powerful transducers. This unit allows for reliable mechanical control of cleaning time and temperature. Safe and efficient heaters enhance cleaning.

High-Precision Workstations  OTSA prides itself on under the scope PCB assembly, custom reworking/soldering, and inspection of PCB's. Nordson EFD high precision dispensers for very fine pitch or large pad applications. We employ a number of heating techniques to achieve consistent solderability.  For example, in-hand techniques that utilize heat baths and/or heat guns can be very effective to address source plane or stubborn rework.

Madell Programmable Reflow Oven These ovens provide both convective and infrared heating capabilities. Convective heating blows air over PCBs so that parts are not directly exposed to heat. Instead, the heat is transferred directly to pads and solder paste, resulting in even temperature distribution to different parts. While infrared radiates from heating elements providing for less solder oxidation, lower power consumption, and a cleaner flux environment. With this oven we can match any solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling. All techniques keep all components safe from excessive heat that may damage components or delaminate the PCB.